Thermal Hero METALLIQ liquid metal compound
★ THERMAL GAP PADNEO PAD 3.0 mm – Maximum Gap Bridging
Gap coolingVRAM, SSD, memory & VRM
Thickness matchedFollow original hardware gap
No paste bridgingDesigned for physical gaps
Cut to fitGPU, RAM, laptop & console gap service

NEO Thermal Pad 3.0 mm – Maximum Gap Bridging

An electrically non-conductive, compressible thermal gap-filler pad for electronic components and cooling surfaces.

€9,99
Taxes included where applicable. Shipping calculated at checkout.
  • Choose the matching thickness to restore proper contact across VRAM, VRM, SSD and memory gaps
  • Cut-to-fit format makes one pad useful across many component layouts
  • Soft, compressible and electrically non-conductive for practical hardware servicing
  • Ideal when the original gap needs a real pad rather than paste or PCM
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Customer Feedback

★★★★★ Customer reviews
★★★★★

“Very fast delivery, Thanks.”

i***r✓ Verified purchase · NEO Pad 100×100×1.0 mm
★★★★★

“Item is as advertised really fast shipping, recommeded, keep it up.”

e***b✓ Verified purchase · NEO Pad 100×100×1.0 mm
★★★★★

“Everything was great.”

m***a✓ Verified purchase · NEO Pad 100×100×1.0 mm

Review disclaimer: customer reviews shown here are sourced from matching Thermal Hero eBay product listings; wording may be translated for presentation while preserving the original meaning.

Technical Data

NEO Thermal Pads

SpecificationValue / description
Product typeElectrically non-conductive, compressible thermal gap-filler pad
Application purposeFilling air gaps and transferring heat between electronic components and cooling surfaces
Recommended applicationsVRAM, VRMs, SSDs, chipsets and other electronic components
Performance classHigh-performance thermal gap-filler pad
Available thicknesses0.5 to 3.0 mm
Available sheet sizes100 × 100 mm, 120 × 20 mm, 80 × 22 mm, 50 × 50 mm and 30 × 30 mm
Density3.2 g/cm³
Recommended operating temperature−40 to +220 °C
HardnessSoft and compressible
Electrical conductivityElectrically non-conductive
ColourPink-red
Application limitationNot recommended as a replacement for thermal paste on direct CPU, GPU die or IHS contact surfaces

How To Apply

Clean surface
1Measure the original gapConfirm the original pad thickness and component contact pattern before removing the old material.
Apply material
2Clean the surfacesRemove old pad residue without damaging components and keep the surfaces dry and free from debris.
Spread or position evenly
3Cut & positionCut the pad to cover the intended component area without overlapping connectors or nearby parts.
Mount cooler
4Check compressionReassemble and verify that the cooler seats correctly and that pad thickness does not reduce CPU/GPU contact pressure.
Application note: Always follow the original hardware contact type, dimensions, thickness and safety requirements.
Thermal Hero METALLIQ liquid metal compound