GRAPHENEX Heat Spreading And Sandwich Cooling Guide
GRAPHENEX is an ultra-thin conductive graphene heat spreader for controlled sandwich stacks with paste or PCM coupling layers.
Recommended Products
Start with the product route that matches your hardware, contact area and installation risk.
GRAPHENEX - Ultra High Performance Graphene Heat Spreader Sheet
Ultra-thin conductive heat spreader.
GRAPHENEX + METALLIQ Cooling Bundle
GRAPHENEX and METALLIQ advanced path.
GAMMA - Advanced Phase-Change Thermal Pad
Phase-change coupling option for direct contact.
GRAPHENEX Is A Heat Spreader
The role of GRAPHENEX is to spread local heat across a wider area. It does not replace paste by itself.
Use A Sandwich Stack
Use a controlled layer stack: heat source, paste or PCM, GRAPHENEX, paste or PCM, heatsink. The coupling layers are necessary for contact.
GRAPHENEX Is Conductive
The sheet must not touch exposed contacts, SMD components or PCB traces. Layout clearance matters.
Choose For Hotspots And Advanced Layouts
Use this route when local heat spreading is the goal and the physical stack allows safe installation.
Material Decision Matrix
Selection Guidance
A correct thermal choice starts with the contact type: direct chip contact, component gap, phase-change service, graphene heat spreading or liquid-metal expert use.
Choose the product family that matches the hardware area, contact pressure, gap height and risk level of the application.
Use the Product Selector when the application is unclear, or open the product cards when the material route is already known.
Recommended When
The hardware area and material type are known and the customer wants a direct buying path.
Check First When
The surface material, pad thickness, gap height or electrical risk is unclear.
Avoid When
The customer wants one material for all areas. A correct thermal refresh often uses several product families.
Installation And Buying Workflow
Only one compact workflow remains on the page. The main content above now carries the topic detail.
Inspect
Identify direct contact, gap material, airflow and electrical risk before buying.
Select
Choose paste, PCM, pad, liquid metal or graphene by the real contact requirement.
Install
Clean surfaces, control thickness or amount, and keep conductive materials isolated.
Verify
Test under load and check temperature, hotspot, noise and stability.
Continue With The Correct Next Page
Use CTAs inside the page instead of overloading the header with too many similar entries.
Questions Before Buying
Short answers for the decision points that matter on this topic.
Which product should I choose first?
Start with the contact type. Direct chip contact usually needs paste or PCM. Component gaps need thermal pads. Liquid metal and graphene are advanced options.
Why are there several product families?
Different cooling areas need different materials. One material cannot safely solve every CPU, GPU, VRAM, SSD and console problem.
When should I use the Product Selector?
Use the Product Selector when you are not sure about surface compatibility, gap thickness or whether the system needs paste, pads, PCM, liquid metal or graphene.