NEO Thermal Paste Workshop Format

A Thermal Hero cooling product designed for hardware thermal service.

Product type• See Technical Data for the exact material type.

Recommended use• Use only for the applications listed in Technical Data.

Technical specification• Check temperature, conductivity and size data before installation.

€49,90

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Gaming PC Cooling Kit – QUANTUM + NEO Thermal Pads

An optimized gaming-PC bundle put together for processor repaste work and component-gap cooling.

QUANTUM• Non-curing paste; 3.5 g/cm³; −50 to +250 °C; electrically non-conductive.

NEO Pads• Compressible gap filler; 0.5–3.0 mm; −40 to +220 °C; electrically non-conductive.

Optimized service set• Direct-contact paste and gap-filling pads selected together so one bundle covers the key cooling zones.

€26,90

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GAMMA Phase-Change Thermal Interface

GAMMA gives compatible processors a clean, pre-cut phase-change interface without paste application.

Phase-change TIM• High-performance PCM; 0.2 mm thick; density 2.7 g/cm³.

44–50 °C activation• Recommended operating temperature: −60 to +130 °C.

CPU / GPU / APU• Specified for desktop PCs, laptops and game consoles with clean, dry, level contact surfaces.

€9,90

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GAMMA PTM 40×40 GPU & PS5 Service Kit

GAMMA gives compatible processors a clean, pre-cut phase-change interface without paste application.

Phase-change TIM• High-performance PCM; 0.2 mm thick; density 2.7 g/cm³.

44–50 °C activation• Recommended operating temperature: −60 to +130 °C.

CPU / GPU / APU• Specified for desktop PCs, laptops and game consoles with clean, dry, level contact surfaces.

€19,90

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GAMMA PTM 40×30 PS5 Service Kit

GAMMA gives compatible processors a clean, pre-cut phase-change interface without paste application.

Phase-change TIM• High-performance PCM; 0.2 mm thick; density 2.7 g/cm³.

44–50 °C activation• Recommended operating temperature: −60 to +130 °C.

CPU / GPU / APU• Specified for desktop PCs, laptops and game consoles with clean, dry, level contact surfaces.

€18,90

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GPU Refresh Kit – ULTRA Paste + NEO Thermal Pads

An optimized service bundle put together for processor repaste work plus VRAM, VRM, SSD and chipset gaps.

ULTRA• Non-curing paste; 3.4 g/cm³; −50 to +250 °C; electrically non-conductive.

NEO Pads• Compressible gap filler; 0.5–3.0 mm; −40 to +220 °C; electrically non-conductive.

Optimized service set• Paste and pads are combined in one purchase to cover both direct contact and common component gaps.

€19,90

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GRAPHENEX + METALLIQ 51×68 Cooling Bundle

An optimized expert bundle combining graphene heat spreading with extreme-performance liquid metal.

GRAPHENEX• 0.025 mm synthetic graphene sheet; up to 220 °C; electrically conductive.

METALLIQ• Gallium–indium–tin liquid metal; 6.4 g/cm³; −50 to +200 °C.

Optimized expert set• GRAPHENEX and METALLIQ are put together for advanced projects where maximum thermal performance is the priority.

€24,90

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GRAPHENEX + METALLIQ 100×100 Cooling Set

An optimized expert bundle combining graphene heat spreading with extreme-performance liquid metal.

GRAPHENEX• 0.025 mm synthetic graphene sheet; up to 220 °C; electrically conductive.

METALLIQ• Gallium–indium–tin liquid metal; 6.4 g/cm³; −50 to +200 °C.

Optimized expert set• GRAPHENEX and METALLIQ are put together for advanced projects where maximum thermal performance is the priority.

€27,90

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GRAPHENEX Graphene Heat-Spreader Sheet

Ultra-thin GRAPHENEX spreads heat laterally across demanding electronics and can be cut for custom projects.

0.025 mm sheet• Available in 100 × 100 mm, 51 × 68 mm and 32 × 32 mm sizes; density 2.25 g/cm³.

Up to 220 °C• Extreme in-plane heat spreading with high through-plane thermal transfer performance.

Electrically conductive• Use with a suitable thermal interface material where thermal contact resistance must be minimised.

€12,90

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GRAPHENEX Performance Kit – Graphene Sheet + ULTRA

An optimized bundle pairing graphene heat spreading with a non-conductive paste for advanced cooling projects.

GRAPHENEX• 0.025 mm synthetic graphene sheet for lateral heat spreading; electrically conductive.

ULTRA• High-performance non-curing paste; 3.4 g/cm³; electrically non-conductive.

Optimized combination• Two complementary materials put together for controlled heat spreading and direct-contact cooling.

€20,90

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Laptop Cooling Kit – ULTRA Paste + NEO Thermal Pads

An optimized service bundle put together for processor repaste work plus VRAM, VRM, SSD and chipset gaps.

ULTRA• Non-curing paste; 3.4 g/cm³; −50 to +250 °C; electrically non-conductive.

NEO Pads• Compressible gap filler; 0.5–3.0 mm; −40 to +220 °C; electrically non-conductive.

Optimized service set• Paste and pads are combined in one purchase to cover both direct contact and common component gaps.

€21,90

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Liquid Metal Accessory Kit

A Thermal Hero cooling product designed for hardware thermal service.

Product type• See Technical Data for the exact material type.

Recommended use• Use only for the applications listed in Technical Data.

Technical specification• Check temperature, conductivity and size data before installation.

€15,90

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METALLIQ Liquid Metal Compound

Extreme-performance liquid metal for experienced users chasing lower processor temperatures on compatible hardware.

Maximum cooling route• Choose METALLIQ when conventional paste is not enough for your compatible high-load system.

Built for extreme cooling• A high-performance choice for experienced users pushing compatible CPU, GPU and APU cooling further.

For expert repaste work• Use a very thin continuous layer on compatible CPU, GPU and APU direct-contact interfaces.

€13,50

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METALLIQ Performance Bundle

An optimized cooling bundle put together for flexible high-performance processor service.

Choose liquid metal• METALLIQ for compatible copper, nickel-plated copper and silicon direct-contact surfaces.

Safer paste option• ULTRA gives you an electrically non-conductive conventional paste route in the same bundle.

Optimized bundle• Two complementary cooling materials selected together for more flexibility and better value in one purchase.

€18,90

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NEO Thermal Pad 0.5 mm – Low-Gap Precision

Choose the correct NEO Pad thickness to restore reliable contact across component gaps.

Match the gap• Available from 0.5 to 3.0 mm so you can replace the original pad thickness accurately.

Built for components• For VRAM, VRMs, SSDs, memory chips and other areas that need a compressible gap filler.

Easy choice• Electrically non-conductive; use paste or PCM instead on direct CPU/GPU cooler contact.

€5,90

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NEO Thermal Pad 1.0 mm – Standard Memory & VRAM

Choose the correct NEO Pad thickness to restore reliable contact across component gaps.

Match the gap• Available from 0.5 to 3.0 mm so you can replace the original pad thickness accurately.

Built for components• For VRAM, VRMs, SSDs, memory chips and other areas that need a compressible gap filler.

Easy choice• Electrically non-conductive; use paste or PCM instead on direct CPU/GPU cooler contact.

€6,90

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NEO Thermal Pad 1.5 mm – High-Load Memory Cooling

Choose the correct NEO Pad thickness to restore reliable contact across component gaps.

Match the gap• Available from 0.5 to 3.0 mm so you can replace the original pad thickness accurately.

Built for components• For VRAM, VRMs, SSDs, memory chips and other areas that need a compressible gap filler.

Easy choice• Electrically non-conductive; use paste or PCM instead on direct CPU/GPU cooler contact.

€7,50

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NEO Thermal Pad 2.0 mm – Extended Gap Applications

Choose the correct NEO Pad thickness to restore reliable contact across component gaps.

Match the gap• Available from 0.5 to 3.0 mm so you can replace the original pad thickness accurately.

Built for components• For VRAM, VRMs, SSDs, memory chips and other areas that need a compressible gap filler.

Easy choice• Electrically non-conductive; use paste or PCM instead on direct CPU/GPU cooler contact.

€7,90

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NEO Thermal Pad 2.5 mm – Large-Gap Compensation

Choose the correct NEO Pad thickness to restore reliable contact across component gaps.

Match the gap• Available from 0.5 to 3.0 mm so you can replace the original pad thickness accurately.

Built for components• For VRAM, VRMs, SSDs, memory chips and other areas that need a compressible gap filler.

Easy choice• Electrically non-conductive; use paste or PCM instead on direct CPU/GPU cooler contact.

€8,50

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NEO Thermal Pad 3.0 mm – Maximum Gap Bridging

Choose the correct NEO Pad thickness to restore reliable contact across component gaps.

Match the gap• Available from 0.5 to 3.0 mm so you can replace the original pad thickness accurately.

Built for components• For VRAM, VRMs, SSDs, memory chips and other areas that need a compressible gap filler.

Easy choice• Electrically non-conductive; use paste or PCM instead on direct CPU/GPU cooler contact.

€9,99

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NEO Everyday Thermal Paste

NEO is the straightforward choice for routine CPU/GPU repaste jobs across PCs, laptops and consoles.

High-performance paste• Density: 2.8 g/cm³; typical viscosity: 215 Pa·s.

−50 to +250 °C• Specified for CPUs, GPUs and APUs in desktop PCs, laptops and game consoles.

Non-conductive• Electrically non-conductive; available in 1 g, 2 g, 3 g, 4 g, 10 g, 25 g and 50 g.

€7,90

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QUANTUM High-End Thermal Paste

Choose QUANTUM for demanding CPU/GPU systems when you want a high-end non-conductive paste route.

Ultra-high-performance• Density: 3.5 g/cm³; typical viscosity: 260 Pa·s.

−50 to +250 °C• Specified for desktop PCs, workstations, laptops and game consoles.

Non-conductive• Electrically non-conductive; available in 1 g, 2 g, 3 g, 4 g, 10 g, 25 g and 50 g.

€12,90

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ULTRA Performance Thermal Paste

Choose ULTRA for high-performance CPU/GPU repaste work with an electrically non-conductive paste.

High-performance paste• Density: 3.4 g/cm³; typical viscosity: 240 Pa·s.

−50 to +250 °C• Recommended operating range for CPU, GPU and APU applications.

Non-conductive• Electrically non-conductive; available in 1 g, 2 g, 3 g, 4 g, 10 g, 25 g and 50 g.

€9,90

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