“Item as described, good price and fast delivery. Happy to buy again.”
0***g✓ Verified purchase · METALLIQ

GRAPHENEX + METALLIQ 51×68 Cooling Bundle
A cooling bundle that combines Thermal Hero materials for a specific hardware service task.
- Optimized enthusiast bundle combining two advanced materials for high-performance thermal projects
- GRAPHENEX spreads heat laterally while METALLIQ targets extreme direct-contact heat transfer
- Ideal when you want both advanced cooling routes available in one coordinated set
- Both materials are electrically conductive; METALLIQ must never be used on aluminium
Technical Data
GRAPHENEX Heat-Spreading Sheet
| Specification | Value / description |
|---|---|
| Product type | Synthetic graphene heat-spreading sheet |
| Application purpose | Lateral heat spreading and reduction of localised hot spots |
| Recommended applications | Electronic components, SSDs, memory modules, displays, batteries and other heat-spreading applications |
| In-plane thermal performance, X–Y | Extreme heat-spreading performance |
| Through-plane thermal performance, Z | High thermal transfer performance |
| Available sizes | 100 × 100 mm, 51 × 68 mm and 32 × 32 mm |
| Sheet thickness | 0.025 mm |
| Density | 2.25 g/cm³ |
| Maximum operating temperature | Up to 220 °C |
| Electrical conductivity | Electrically conductive |
| Storage conditions | Store dry, clean and protected from mechanical damage |
| Application requirement | Use with a suitable thermal interface material where thermal contact resistance must be minimised |
*GRAPHENEX is a heat spreader and not a conventional gap-filling thermal pad. Depending on the contact surfaces and mounting configuration, an additional thermal interface material may be required.
Technical Data
METALLIQ Liquid Metal
| Specification | Value / description |
|---|---|
| Product type | Gallium–indium–tin liquid-metal thermal interface material |
| Application purpose | High-performance heat transfer between processors and cooling surfaces |
| Recommended applications | CPUs, GPUs and APUs in desktop PCs, laptops and game consoles |
| Performance class | Extreme-performance thermal interface material |
| Available fill weights | 1 g, 2 g, 3.5 g, 5 g, 7.5 g and 10 g |
| Density | 6.4 g/cm³ |
| Recommended operating temperature | −50 to +200 °C |
| Physical state | Liquid at temperatures of approximately 10 °C and above; solid below approximately 10 °C |
| Electrical conductivity | Electrically conductive |
| Appearance | Silver-coloured metallic liquid |
| Compatible contact surfaces | Copper, nickel-plated copper and silicon |
| Incompatible contact surfaces | Do not use on aluminium |
| Surface requirements | Clean, dry and level direct-contact surfaces with uniform mounting pressure |
| Application method | Apply as a very thin, continuous layer between the processor surface and cooler |
*If METALLIQ solidifies at temperatures below approximately 10 °C, allow it to warm to room temperature before application.
Customer Feedback
“Excellent item as described and fast delivery. My PS5 is running again.”
y***i✓ Verified purchase · METALLIQ“Item as described. Fast shipping. Happy to buy again.”
-***-✓ Verified purchase · METALLIQ“Everything as described.”
k***2✓ Verified purchase · METALLIQ“Schnelle Lieferung. Danke”
v***v✓ Verified purchase · METALLIQ“Schnelle Lieferung, netter Kontakt, Team tradestation sagt vielen Dank!”
-***n✓ Verified purchase · METALLIQ“..alles bestens !!!”
e***i✓ Verified purchase · METALLIQ“Sehr schnelle Lieferung und sehr gute Kommunikation. Danke”
s***f✓ Verified purchase · METALLIQReview disclaimer: customer reviews shown here are sourced from matching Thermal Hero eBay product listings; wording may be translated for presentation while preserving the original meaning.
How To Apply




