Thermal Pads For VRAM, SSD, Memory And Component Gaps
NEO thermal pads are used where a component sits below the heatsink and needs a compressible gap filler.
Pad performance depends on correct thickness and compression. Pads are not the normal CPU contact surface material.
Thermal Pad Catalog
Choose the pad thickness that matches the original gap and compression target.
NEO PAD 0.5 mm – Low-Gap Precision
Low-gap pad for tight component contact and thin heatsink spacing.
NEO PAD 1.0 mm – Standard Overclocking Memory
Standard pad route for common VRAM, memory and SSD gaps.
NEO PAD 1.5 mm – High-Load Memory Cooling
Thicker pad route for larger component spacing.
NEO PAD 2.0 mm – Extended Tolerance Applications
Extended tolerance pad for larger service gaps.
NEO PAD 2.5 mm – Large Gap Compensation
Large-gap compensation for wider component and heatsink spacing.
NEO PAD 3.0 mm – Maximum Gap Bridging
Maximum gap bridging for the largest supported tolerance applications.
How To Choose This Material Family
Use this logic before adding products to the basket.
Pads bridge physical distance between component and heatsink.
Too thick can reduce core contact pressure. Too thin leaves an air gap.
Use pads for VRAM, SSDs, memory chips and power components.