NEO PAD 2.0 mm – Extended Tolerance Applications

80 × 22 mm

€14,90

Available Variants

Select the required THERMAL HERO NEO PAD size and quantity for your cooling application.

80 × 22 mm High-performance thermal pad solution €14,90 Available 120 × 20 mm High-performance thermal pad solution €9,50 Available 30 × 30 mm High-performance thermal pad solution €7,90 Available 50 × 50 mm High-performance thermal pad solution €9,50 Available 100 × 100 mm High-performance thermal pad solution €19,90 Available

Selected size: 80 × 22 mm

Price: €14,90

Quantity

THERMAL HERO NEO Thermal Pads – Overclocking Edition are designed specifically for components that operate above standard thermal limits in overclocked and performance-tuned systems.

Thermal pads inherently have a higher thermal resistance than thermal paste or liquid metal. For this reason, NEO Thermal Pads are NOT intended for direct CPU or GPU die cooling.

Instead, they are engineered for components where paste cannot be applied reliably, where mechanical tolerances vary, or where long-term stability is more important than peak benchmark temperatures.

Primary Target Components

GPU memory (VRAM)
M.2 SSDs (NVMe / 2280 standard)
RAM / system memory modules (DDR4 / DDR5)
SSD controllers
Chipsets and auxiliary ICs

2.0 mm – Extended Tolerance Applications

Recommended for:

GPU backplates (memory-side cooling)
Custom heatsink solutions
Industrial PCBs

Why:

Compensates larger mechanical gaps
Reliable contact across uneven surfaces
Stable thermal coupling in extended tolerance designs

Why Thermal Pads Should Not Be Used on CPUs

Thermal pads are designed to bridge small gaps between components and heatsinks rather than minimizing thermal resistance on direct silicon contact surfaces.

Higher thermal resistance compared to paste or liquid metal
Designed to compensate mechanical gaps
Optimized for controlled compression
Not intended for direct die pressure

Application Guidance

❌ Not suitable for CPUs, GPU dies or delidded processors
✅ Ideal for memory modules and secondary heat sources
Stable thermal interface for long-term system operation
Electrically non-conductive and dimensionally stable

NEO Thermal Pads – Overclocking Edition are electrically non-conductive, dimensionally stable thermal interface materials developed for memory-intensive and thermally stressed systems.