Laptop Cooling Kit – ULTRA Paste + NEO Thermal Pads

An optimized service bundle put together for processor repaste work plus VRAM, VRM, SSD and chipset gaps.

ULTRA• Non-curing paste; 3.4 g/cm³; −50 to +250 °C; electrically non-conductive.

NEO Pads• Compressible gap filler; 0.5–3.0 mm; −40 to +220 °C; electrically non-conductive.

Optimized service set• Paste and pads are combined in one purchase to cover both direct contact and common component gaps.

€21,90

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GPU Refresh Kit – ULTRA Paste + NEO Thermal Pads

An optimized service bundle put together for processor repaste work plus VRAM, VRM, SSD and chipset gaps.

ULTRA• Non-curing paste; 3.4 g/cm³; −50 to +250 °C; electrically non-conductive.

NEO Pads• Compressible gap filler; 0.5–3.0 mm; −40 to +220 °C; electrically non-conductive.

Optimized service set• Paste and pads are combined in one purchase to cover both direct contact and common component gaps.

€19,90

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GRAPHENEX + METALLIQ 51×68 Cooling Bundle

An optimized expert bundle combining graphene heat spreading with extreme-performance liquid metal.

GRAPHENEX• 0.025 mm synthetic graphene sheet; up to 220 °C; electrically conductive.

METALLIQ• Gallium–indium–tin liquid metal; 6.4 g/cm³; −50 to +200 °C.

Optimized expert set• GRAPHENEX and METALLIQ are put together for advanced projects where maximum thermal performance is the priority.

€24,90

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GAMMA PTM 40×40 GPU & PS5 Service Kit

GAMMA gives compatible processors a clean, pre-cut phase-change interface without paste application.

Phase-change TIM• High-performance PCM; 0.2 mm thick; density 2.7 g/cm³.

44–50 °C activation• Recommended operating temperature: −60 to +130 °C.

CPU / GPU / APU• Specified for desktop PCs, laptops and game consoles with clean, dry, level contact surfaces.

€19,90

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GAMMA PTM 40×30 PS5 Service Kit

GAMMA gives compatible processors a clean, pre-cut phase-change interface without paste application.

Phase-change TIM• High-performance PCM; 0.2 mm thick; density 2.7 g/cm³.

44–50 °C activation• Recommended operating temperature: −60 to +130 °C.

CPU / GPU / APU• Specified for desktop PCs, laptops and game consoles with clean, dry, level contact surfaces.

€18,90

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GRAPHENEX Performance Kit – Graphene Sheet + ULTRA

An optimized bundle pairing graphene heat spreading with a non-conductive paste for advanced cooling projects.

GRAPHENEX• 0.025 mm synthetic graphene sheet for lateral heat spreading; electrically conductive.

ULTRA• High-performance non-curing paste; 3.4 g/cm³; electrically non-conductive.

Optimized combination• Two complementary materials put together for controlled heat spreading and direct-contact cooling.

€20,90

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Liquid Metal Accessory Kit

A Thermal Hero cooling product designed for hardware thermal service.

Product type• See Technical Data for the exact material type.

Recommended use• Use only for the applications listed in Technical Data.

Technical specification• Check temperature, conductivity and size data before installation.

€15,90

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METALLIQ Performance Bundle

An optimized cooling bundle put together for flexible high-performance processor service.

Choose liquid metal• METALLIQ for compatible copper, nickel-plated copper and silicon direct-contact surfaces.

Safer paste option• ULTRA gives you an electrically non-conductive conventional paste route in the same bundle.

Optimized bundle• Two complementary cooling materials selected together for more flexibility and better value in one purchase.

€18,90

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Gaming PC Cooling Kit – QUANTUM + NEO Thermal Pads

An optimized gaming-PC bundle put together for processor repaste work and component-gap cooling.

QUANTUM• Non-curing paste; 3.5 g/cm³; −50 to +250 °C; electrically non-conductive.

NEO Pads• Compressible gap filler; 0.5–3.0 mm; −40 to +220 °C; electrically non-conductive.

Optimized service set• Direct-contact paste and gap-filling pads selected together so one bundle covers the key cooling zones.

€26,90

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